Procurement & Assembly Lead Times:
Quick-Turn – 2-4 days (Depending on Customers Request)
Standard Turn – 5 days (Assembly Only)
Full Turnkey – 10-15 days (Depending on Availability of Parts)
PCB Assembly Capabilities:
Surface Mount Technology:
• Capable of placements down to 01005
• Fine pitch BGA (FBGA)
• QFN and lead-less IC’s
• Reflow thermal profiling
Through Hole Technology:
• Nordson Select Selective soldering for mixed technology
• Up to 18”x15” board size.
12″x8″ with a .25″ border (recommended)
*Contact us for panelization advise!
100% Visual Inspection Under Microscope
Inline Aqueous Cleaning System with Wash & Dry Cycles
Batch Oven for Complete Moisture Removal
⋅ For any urgent or special requests please contact us ⋅
BGA X-Ray Inspection
BGA Rework & Reballing
For full turn-key services, we offer all services from design, materials procurement including PCB, assembly, quality inspection, fuctional testing, and final product assembly.
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