PCB Assembly Capabilities:

Surface Mount Technology:
• Capable of placements down to 01005
• Fine pitch BGA (FBGA)
• QFN and lead-less IC’s
• Reflow thermal profiling

Through Hole Technology:
• Nordson Select Selective soldering for mixed technology
assemblies

Board Size:
• Up to 18”x15” board size.

Panelization:
12″x8″ with a .25″ border (recommended)

*Contact us for panelization advise!

Inspection:

AOI Inspection
100% Visual Inspection Under Microscope

Cleaning:

Inline Aqueous Cleaning System with Wash & Dry Cycles
Batch Oven for Complete Moisture Removal

⋅ For any urgent or special requests please contact us ⋅

Testing:

BGA X-Ray Inspection
Functional Testing

Rework:

BGA Rework & Reballing

For full turn-key services, we offer all services from design, materials procurement including PCB, assembly, quality inspection, fuctional testing, and final product assembly.