Surface Mount Assembly

The Quad Systems QSA-30 employs upward vision to achieve perfect placement of BGA’s and other fine pitch components. It has placement rates of up to 13,000 components per hour. It provides accurate placement of components ranging in size from 0402 capacitors and resistors to QFP 208’s. It accommodates boards ranging in from 2"x2" to 16"x18".

Surface Mount Reflow

The Vitronics Soltec XPM-2 maintains uniform heat flow in each zone. It delivers 100% repeatable profile performance. Temperatures vary no more than plus or minus 2°C, providing accurate graphical
documentation of temperature profiles.

Surface Mount Printing

The Quad Systems VMP-20 has 100% vertical controlled speed separation for maximum repeatability, providing perfect solder paste deposition down to12-mil pitch.

Wave Soldering

The Electrovert Astrapak has dual preheaters, infrared and convection heating to avoid component shock. It is a surface mount component compatible, high throughput chip wave machine.

Aqueous Cleaning

The Aqueous Technologies AQ400 employs a resistivity meter to clean to mil-spec. Top, bottom and side sprayers clean fine pitch components and beneath BGA’s. Precisely controlled temperature and cleaning cycles deliver repeatable results.

Selective Solder

The Ace Production Technologies KISS-102 is perfect for mixed technology boards. It ensures the highest quality through-hole solder joints with exceptional precision and repeatablity.

Thermal Profiler

The ECD M.O.L.E. allows for precise thermal profiling of the reflow process with up to eight thermocouples.
It provides a graphical display of reflow profile to ensure the highest quality solder joints

Other

We have a full complement of detailed inspection and rework equipment, and a milling machine on site to make custom fixtures.